Maneeroth ์. (2024). Wire Bond Ability Enhancement of 8 Leads Small Outline Integrated Circuit and 14 Leads Thin Shrink Small Outline Package Using AuPd Coated Cu Wire Bonding for Automotive Devices: Wire Bond Ability Enhancement of 8 Leads Small Outline Integrated Circuit and 14 Leads Thin Shrink Small Outline Package Using AuPd Coated Cu Wire Bonding for Automotive Devices. ECTI Transactions on Electrical Engineering, Electronics, and Communications, 22(3). https://doi.org/10.37936/ecti-eec.2024223.252553