Maneeroth ์. Wire Bond Ability Enhancement of 8 Leads Small Outline Integrated Circuit and 14 Leads Thin Shrink Small Outline Package Using AuPd Coated Cu Wire Bonding for Automotive Devices: Wire Bond Ability Enhancement of 8 Leads Small Outline Integrated Circuit and 14 Leads Thin Shrink Small Outline Package Using AuPd Coated Cu Wire Bonding for Automotive Devices. ECTI Transactions on Electrical Engineering, Electronics, and Communications, [S. l.], v. 22, n. 3, 2024. DOI: 10.37936/ecti-eec.2024223.252553. Disponível em: https://ph02.tci-thaijo.org/index.php/ECTI-EEC/article/view/252553. Acesso em: 29 apr. 2025.