SUKANTHARAT, A.; UGSORNRAT, K.; SUMITHPIBUL, C. Effect of Epoxy Molding Compound Material and Roughness Leadframe to Integrated Circuit Package for Automotive Devices. ECTI Transactions on Electrical Engineering, Electronics, and Communications, [S. l.], v. 18, n. 2, p. 179–188, 2020. DOI: 10.37936/ecti-eec.2020182.240488. Disponível em: https://ph02.tci-thaijo.org/index.php/ECTI-EEC/article/view/240488. Acesso em: 5 may. 2024.