H. M., V.; RAMAKRISHNAN, V. N. Geometrical Variation of a Conductive Filament in RRAM and Its Impact on a Single-Event Upset. ECTI Transactions on Electrical Engineering, Electronics, and Communications, [S. l.], v. 20, n. 1, p. 32–38, 2022. DOI: 10.37936/ecti-eec.2022201.246101. Disponível em: https://ph02.tci-thaijo.org/index.php/ECTI-EEC/article/view/246101. Acesso em: 27 apr. 2024.