Maneeroth ์. Wire Bond Ability Enhancement of 8 Leads Small Outline Integrated Circuit and 14 Leads Thin Shrink Small Outline Package Using AuPd Coated Cu Wire Bonding for Automotive Devices: Wire Bond Ability Enhancement of 8 Leads Small Outline Integrated Circuit and 14 Leads Thin Shrink Small Outline Package Using AuPd Coated Cu Wire Bonding for Automotive Devices. ECTI-EEC [internet]. 2024 Oct. 29 [cited 2025 Apr. 28];22(3). available from: https://ph02.tci-thaijo.org/index.php/ECTI-EEC/article/view/252553