Boonrit, C. and Chaikunchuensakun, S. (1) “Thermal Energy Analysis for Sulfuric Acid Dilution Step in Copper Electroplating Process”, Science & Technology Asia, 15(5), pp. 55-59. Available at: https://ph02.tci-thaijo.org/index.php/SciTechAsia/article/view/41241 (Accessed: 14August2020).