Boonrit, C., and S. Chaikunchuensakun. “Thermal Energy Analysis for Sulfuric Acid Dilution Step in Copper Electroplating Process”. Science & Technology Asia, Vol. 15, no. 5, 1, pp. 55-59, https://ph02.tci-thaijo.org/index.php/SciTechAsia/article/view/41241.