Boonrit C, Chaikunchuensakun S. Thermal Energy Analysis for Sulfuric Acid Dilution Step in Copper Electroplating Process. Sci Tech Asia [internet]. 2015 Oct. 21 [cited 2026 Apr. 22];15(5):55-9. available from: https://ph02.tci-thaijo.org/index.php/SciTechAsia/article/view/41241