Chantaramanee, S. and Sungkhaphaitoon, P. (2018) “The Study of Wettability and Microstructure for SAC305 and SAC305-0.5In Lead-Free Solders on Copper Substrate”, Thai Industrial Engineering Network Journal, 4(1), pp. 42–51. Available at: https://ph02.tci-thaijo.org/index.php/ienj/article/view/176747 (Accessed: 2 May 2024).