Chantaramanee, Suchart, and Phairote Sungkhaphaitoon. “The Study of Wettability and Microstructure for SAC305 and SAC305-0.5In Lead-Free Solders on Copper Substrate”. Thai Industrial Engineering Network Journal 4, no. 1 (June 30, 2018): 42–51. Accessed May 2, 2024. https://ph02.tci-thaijo.org/index.php/ienj/article/view/176747.