KHAJORNRUNGRUANG, P.; KIMURA, K.; BABA, A.; YASUDA, K.; TANAKA, A. Development of Orderly Micro Asperity on Polishing Pad Surface for Chemical Mechanical Polishing (CMP) Process using Anisotropic Etching. Applied Science and Engineering Progress, [S. l.], v. 3, n. 3, p. 29–34, 2013. Disponível em: https://ph02.tci-thaijo.org/index.php/ijast/article/view/67397. Acesso em: 9 oct. 2026.