C.Y., Y.; S., R. Surface Modification and Thermal Bonding in COC Polymeric Microfluidic Chip. Applied Science and Engineering Progress, [S. l.], v. 6, n. 2, p. 33–38, 2013. Disponível em: https://ph02.tci-thaijo.org/index.php/ijast/article/view/67408. Acesso em: 18 sep. 2026.