C.Y., Y. and S., R. (2013) “Surface Modification and Thermal Bonding in COC Polymeric Microfluidic Chip”, Applied Science and Engineering Progress, 6(2), pp. 33–38. available at: https://ph02.tci-thaijo.org/index.php/ijast/article/view/67408 (accessed: 18 September 2026).