C.Y. Y, S. R. Surface Modification and Thermal Bonding in COC Polymeric Microfluidic Chip. Applied Science and Engineering Progress [internet]. 2013 Dec. 17 [cited 2026 Sep. 18];6(2):33-8. available from: https://ph02.tci-thaijo.org/index.php/ijast/article/view/67408