1.
Wongsri C, Intorn P, Photong C. Glue Pellet Control System for Assembly of Electronic Components on Printed Circuit Boards: doi: 10.14456/mijet.2019.1. Engineering Access [Internet]. 2019 Jun. 30 [cited 2024 Apr. 28];5(1):1-8. Available from: https://ph02.tci-thaijo.org/index.php/mijet/article/view/10.14456.mijet.2019.1