Characterization of p+-n Junctions and a Quasi-One-Dimensional Structure Fabricated by Low-Energy Focused Ion Beam

Main Article Content

Peerasak Chantngarm

Abstract

The electrical properties of implanted p+ layers, shallow p+-n junctions, and a quasi-one-dimensional structure fabricated without masks by 20-keV Ga+ focused ion beam (FIB) on crystalline Si substrates were investigated in details. The distribution profile from SIMS showed discrepancies from LSS theory, which is considered to be the results of low beam energy and high beam current density. From Hall effect measurements, the Hall drift mobility was 131 cm2 / V-sec, which is 62% of the projected value due to remained defects after annealing. The I - V characteristics of p+-n junctions illustrated four distinct regions in the forward bias region and rising saturation current in the reverse bias region. Higher than expected leakage current is considered to be the results of residue damages after annealing. For the first time, the resistance of a quasi-one-dimensional structure was investigated. The resistance is 1 x 1 ,
which is 647 times higher than the projected value. The cause of this phenomenon is considered to be the combined effects of interfacial roughness, the residue damages, and the shape of the structure.

Article Details

How to Cite
Chantngarm, P. (2008). Characterization of p+-n Junctions and a Quasi-One-Dimensional Structure Fabricated by Low-Energy Focused Ion Beam. ECTI Transactions on Electrical Engineering, Electronics, and Communications, 7(2), 39–46. https://doi.org/10.37936/ecti-eec.200972.171882
Section
Research Article

References

[1] R. H. Dennard, F. H. Yu, V. L. Rideout, E. Bassous, and A. R. LeBlac, "Design of Ion Implanted MOSFET's with Very Small Physical Dimensions," IEEE Journal of Solid-State Circuits, Vol. 9, No. 5, pp. 256-268, 1974.

[2] G. Baccarani, M. R. Wordeman, and R. H. Dennard, "Generalized Scaling Theory and Its Application to a 1=4 Micrometer MOSFET Design," IEEE Transactions of Electron Devices, Vol. 31, No. 4, pp. 452-462, 1984.

[3] C-M Lin and A. J. Steckl, "Si p+-n Shallow Junction Using On-Axis Ga+ Implantation," Applied Physics Letters, Vol. 52, No. 24, pp. 2049-2051, 1988.

[4] Shin Nam Hong, Gary A. Ruggles, Jimmie J. Wortman, Mehmet C. Ozturk, "Material and Electrical Properties of Ultra-Shallow p+-n Junctions Formed by Low-Energy Ion Implantation and Rapid Thermal Annealing," IEEE Transactions on Electron Devices, Vol. 38, No. 3, pp.476-486, 1991.

[5] H. Matsuoka, T. Ichiguchi, T. Yoshimura, and E. Takeda, "Mobility Modulation in a Quasi-One-Dimensional Si-MOSFET with a Dual-Gate Structure," IEEE Electron Device Letters, Vol. 13, No. 1, pp. 20-22, 1992.

[6] J. Tanaka, A. Sawada, "Simulation of a High Performance MOSFET with a Quantum Wire Structure Incorporating a Periodically Bent SiSiO2 Interface," IEEE Transactions on Electron Devices, Vol. 43, No. 12, pp. 2185-2189, 1996.

[7] C. C. Shen, J. Murguia, N. Goldsman, M. Peckerar, J. Melngailis, and D. A. Antoniadis, "Use of Focused-Ion-Beam and Modeling to Optimize Submicron MOSFET Characteristics," IEEE Transactions on Electron Devices, Vol. 45, No. 2, pp. 453-459, 1998.

[8] J. E. Murguia, M. I. Shepard, J. Melngailis, A. L. Lattes, and S. C. Munroe, "Increase in Silicon Charge Coupled Devices Speed with Focused Ion Beam Implanted Channels," The Journal of Vacuum Science and Technology B, Vol. 9, No. 5, pp. 2714-2717, 1991.

[9] A. J. Steckl, H. C. Mogul, and S. Mogren, "Electrical Properties of Nanometer-Scale Si p+-n Junctions Fabricated by Low Energy Ga+ Focused Ion Beam Implantation," The Journal of Vacuum Science and Technology B, Vol. 9, No. 5, pp. 2718-2721, 1991.

[10] S. W. Novak, C. W. Magee, H. C. Mogul, A. J. Steckl, and M. Pawlik, "Secondary Ion Mass Spectrometry Depth Pro¯ling of Nanometer Scale p+-n Junctions Fabricated by Ga+ Focused Ion Beam Implantation," The Journal of Vacuum Science and Technology B, Vol. 10, No. 1, pp. 333-335, 1992.

[11] H. Ryssel and I. Ruge, Ion Implantation, John Wiley & Sons, UK, 1986, pp. 5-16.

[12] J. Lindhard and M. Schar®, "Energy Dissipation by Ions in the keV Region," Physical Re- view, Vol. 124, No. 1, pp. 128-130, 1961.

[13] J. Singh, Semiconductor Devices, John Wiley & Sons, Inc., New York, 2001, pp. 185-191.

[14] D. K. Schroder, Semiconductor Material and Device Characterization, John Wiley & Sons, Inc., New Jersey, 2006, pp. 185-188.

[15] S. M. Sze, Semiconductor Devices : Physics and Technology, John Wiley & Sons, New York, 1985, pp. 92-96.

[16] B. G. Streetman, and Sanjay Banerjee, Solid State Electronic Devices, Prentice Hall International, Inc., New Jersey, 2000, pp. 211-216.

[17] Eiko Engineering, Focused Ion Beam System User Manual, 1995.

[18] B. G. Streetman, and Sanjay Banerjee, Solid State Electronic Devices, Prentice Hall International, Inc., New Jersey, 2000, pp. 226, 434.

[19] J. F. Gibbons, W. S. Johnson, and S. W. Mylroie, Projected Range Statistics, Semiconductors and Related Materials, Dowden, Hutchinson& Ross, Inc., Pennsylvania, 1975, pp.29.

[20] S. M. Sze and J. C. Irvin, "Resistivity, Mobility and Impurity Levels in GaAs, Ge, and Si at 300 K," Solid-state Electronics, Vol.11, pp. 599-602, 1968.

[21] S. H. Yang, S. J. Morris, S. Tian, K. B. Parab, and A. F. Tasch, "Monte Carlo Simulation of Arsenic Ion Implantation in (100) Single-Crystal Silicon," IEEE Transactions on Semiconductor Manufacturing, Vol. 9, No. 1, pp. 49-58, 1996.

[22] Y. Takamura, E. H. Kim, S. H. Jain, P. B. Griffin, and J. D. Plummer, "The Use of Laser Annealing to Reduce Parasitic Series Resistances in MOS Devices," Proceedings of the 14th International Conference on Ion Implantation Technology, pp. 56-59, 2002.

[23] S. R. Walther, S. Mehta, J. Weeman, A. Grouillet and D. Brown, "Dopant Channeling as a Function of Implant Angle for Low Energy Applications," Proceedings of the 12th International Conference on Ion Implantation Technology, pp. 126-129, 1998.

[24] S. N. Hong, G. A. Ruggles, J. J. Wortman, and M. C. Ozturk, "Material and Electrical Properties of Ultra-Shallow p+-n Junctions Formed by Low-Energy Ion Implantation and Rapid Thermal Annealing," IEEE Transactions on Electron Device, Vol. 38, No. 3, pp. 476-486, 1991.

[25] P. Chantngarm, "Maskless etching of Microfabricated Structures with Low-Power Focused Ion Beam," Proceedings of the 2007 Electrical Engineering / Electronics, Computer, Telecommunications and Information Technology (ECTI) International Conference, pp. 194-197, 2007.

[26] S. M. Sze, Physics of Semiconductor Devices, John Wiley & Sons, USA, 1981, pp. 29.

[27] H. Matsuoka, T Ichiguchi, T. Yoshimura, and E. Takeda, "Mobility Modulation in a Quasi-One-Dimensional Si-MOSFET with a Dual-Gate Structure," IEEE Transactions on Electron Device Letters, Vol. 13, No. 1, pp. 20-22, 1992.

[28] W. Barvosa-Carter, M. J. Aziz, A. -V. Phan, T. Kaplan, and L. J. Gray, "Interfacial roughening during solid phase epitaxy: Interaction of dopant, stress, and anisotropy e®ects," Journal of Applied Physics, Vol. 96, No. 10, pp. 5462- 5468, 2004.

[29] M. Tamura, S. Shukuri, Y. Wada, Y. Madokoro, and T. Ishitani, "Focused Ion Beam Implantation into Si," Proceeding of the 12th International Symposium of Hosei University, pp. 17-24, 1988.

[30] Steven W. Novak and Charles W. Magee, "Secondary ion mass spectrometry depth profiling of nanometer-scale p+-n junctions fabricated by Ga+ focused ion beam implantation," Journal of Vacuum Science Technology B, Vol. 10, No. 1, pp. 333-335, 1992.