Wire Bond Ability Enhancement of 8 Leads Small Outline Integrated Circuit and 14 Leads Thin Shrink Small Outline Package Using AuPd Coated Cu Wire Bonding for Automotive Devices Wire Bond Ability Enhancement of 8 Leads Small Outline Integrated Circuit and 14 Leads Thin Shrink Small Outline Package Using AuPd Coated Cu Wire Bonding for Automotive Devices
Main Article Content
Abstract
Paper present a study enhancement of wire bonding process in the integrated circuit package with 2N AuPd coated Cu wire (2N-AuPdCu) for Automotive devices. Wire bonding is the electrical connection between pad and leadframe. In present, Au wire is recently use for interconnection while the gold price still exorbitant and caused concern to the wire bonding cost. Cu wire is a lower price and considered to be an alternative for the interconnection but still concern in term of corrosion and reliability. Recently, 4N AuPd coated Cu wire (4N-AuPdCu) material have been introduced for automotive device but still encounter the reliability problem. The 2N AuPd coated Cu wire was developed version for more reliability enhancement and consider to use for alternative wire of automotive device. In the experiment, Au wire, 4NAuPdCu wire and 2N AuPd coated Cu wire were used for wire bonding process on 8 leads Small Outline Integrated Circuit Package (8L-SOIC) and 14 leads Thin Shrink Small Outline Package (14L-TSSOP) to compare wire bond ability. Analysis, this package tested wire bond ability and reliability. The results performed well in wire bond ability and reliability for 2N AuPd coated Cu wire when comparing with Au wire and 4N AuPd coated Cu wire. Therefore, 2N AuPd coated Cu wire can enhance the quality and reliability for 8L-SOIC package and 14L-TSSOP package for automotive device.
Article Details
This work is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.
This journal provides immediate open access to its content on the principle that making research freely available to the public supports a greater global exchange of knowledge.
- Creative Commons Copyright License
The journal allows readers to download and share all published articles as long as they properly cite such articles; however, they cannot change them or use them commercially. This is classified as CC BY-NC-ND for the creative commons license.
- Retention of Copyright and Publishing Rights
The journal allows the authors of the published articles to hold copyrights and publishing rights without restrictions.
References
Rao R. Tummala. and E. Chair, “Packaging: Past, Present and Future,” IEEE 6th International Conference on Electronic Packaging Technology, 2005.
C. H. Cheng, H. L. Hsiao, et al., “Low Cost Silver Alloy Wire Bonding with Excellent Reliability Performance,” Electronic Components & Technology Conference, pp. 1569-1573, 2013.
C. H. Chen, Y. C. Lin, et al., “Evaluation of Corrosion Resistance of Ag-Alloy Bonding Wires for Electronic Packaging,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 8, pp. 146-153, 2018.
A. Vannozzi, A. Augieri, et al., “Development of Low Aspect Ratio Coated Conductor,” IEEE Transactions on Applied Superconductivity, vol. 25, 2015.
T. H. Chuang, C. C. Chang, et al., “Formation and Growth of Intermetallics in an Annealing-Twinned Ag-8Au-3Pd Wire Bonding Package During Reliability Tests,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 3, pp. 3-9, 2013.
W. Robl, M. Melzl, et al., “Last Metal Copper Metallization for Power Devices,” IEEE Transactions on Semiconductor Manufacturing, vol. 21, pp. 358-362 , 2008.
R. Klengel, J. Schischka, et al., “Comparative Reliability Study of Au Wire Bond Contacts on Al Metallization vs. Over Pad Metallization,” IEEE 66th Electronic Components and Technology Conference, pp. 2164-2168, 2016.
P. Ratchev, S. Stoukatch, B. Swinnen, “Mechanical reliability of Au and Cu wire bonds to Al, Ni/Au and Ni/Pd/Au capped Cu bond pads,” Microelectronics Reliability 46, pp. 1315-1325, 2006.
B. H. Jung, B. K. Yu, et al., “Effect of Pd distribution at free air ball in Pd coated Cu wire,” IEEE 19th Electronics Packaging Technology Conference, pp. 1-5, 2017.
S. Kaimori, T. Nonaka, A. Mizoguchi, “The Development of Cu Bonding Wire With Oxidation-Resistant Metal Coating,” IEEE Transactions on Advanced Packaging, vol. 29, pp. 227-231 , 2006.
G. C. Leong, H. Uda, “Comparative Reliability Studies and Analysis of Au, Pd Coated Cu and Pd-Doped Cu Wire in Microelectronics Packaging,” Comparative Reliability Studies and Analysis, vol. 8, pp. 1-8, 2013.
I. Qin, B. Chylak, et al., “Ball Bond Process Optimization with Cu and Pd-Coated Cu Wire,” ECS Transactions, vol. 44 (1), pp. 891-901, 2012.
H. Seki, C. Ping, et al., “An Evaluation of Effects of Molding Compound Properties on Reliability of Cu Wire Components,” Electronic Components and Technology Conference, pp. 363-369, 2011.
I. Qin, H. Xu, et al., “Process Optimization and Reliability Study for Cu Wire Bonding Advanced Nodes,” Electronic Components & Technology Conference, pp. 1523-1528, 2014.
C. L. Gan and U. Hashim, “Reliability Assessment and Activation Energy Study of Au and Pd-Coated Cu Wires Post High Temperature Aging in Nanoscale Semiconductor Packaging,” Journal of Electronic Packaging, vol. 153, pp. 1-7, 2013.