ผลกระทบของธาตุเจืออินเดียมต่อชั้นความหนาของสารประกอบเชิงโลหะของโลหะบัดกรีไร้สารตะกั่ว Sn-3.0Ag-0.5Cu-0.5In บนวัสดุฐานทองแดง

Abstract

This study investigates the influence of indium on thickness of intermetallic compound layer of lead-free solder SAC305-0.5In on a copper substrate. The samples in the experiment were alloying elements: SAC305 and SAC305-0.35In. In the experiment wettability, microstructure and thickness of intermetallic compound layer were analyzed. An independent variable was the temperature of 260^oC and the dependent variables were three durations of time, namely, 30, 40 and 50 seconds. The results of the study indicated that the chemical properties of SAC305 and SAC305-0.35In passed the standard criteria of all components. The melting point of SAC305-0.35In was found to decrease for 3.8^oC or 1.7% when compared to that of SAC305.  The wettability of SAC305 and SAC305-0.35In with contact angle at temperature of 260^oC for 30, 40 and 50 seconds had a tendency to decrease with increasing time. In terms of microstructure, the phase of Ag₃(Sn,In) and Cu₆(Sn,In)₅ appeared when an amount of indium increased. In addition, the intermetallic compound layer remaining between copper and both types of lead-free solder was Cu₆Sn₅.