Glue Pellet Control System for Assembly of Electronic Components on Printed Circuit Boards
This paper presents a glue pellet control system for assembly of electronic components on printed circuit boards, which has an objective to control silicone glue to achieve constant volume and helps to reduce wastes as required by the company using the motor control technique. The experimental results of the proposed system were evaluated and compared to the previous system, which was the air compressing system. The test results were found that the weight and volume of the silicone glue using the proposed system providing more accuracy and precision than the pneumatic by 0.0013 compared to 0.0021; 38%. In addition, the system also provided better full usage of glue from the tube compared to the previous system.
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