Glue Pellet Control System for Assembly of Electronic Components on Printed Circuit Boards

  • Chadaporn Wongsri Mahasarakham University
  • Phammatorn Intorn Sony Technology (Thailand) Co., Ltd.
  • Chonlatee Photong Mahasarakham University
Keywords: glue pellet control, assembly of electronic components, silicon glue

Abstract

This paper presents a glue pellet control system for assembly of electronic components on printed circuit boards, which has an objective to control silicone glue to achieve constant volume and helps to reduce wastes as required by the company using the motor control technique. The experimental results of the proposed system were evaluated and compared to the previous system, which was the air compressing system. The test results were found that the weight and volume of the silicone glue using the proposed system providing more accuracy and precision than the pneumatic by 0.0013 compared to 0.0021; 38%. In addition, the system also provided better full usage of glue from the tube compared to the previous system.

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Author Biographies

Chadaporn Wongsri, Mahasarakham University

Faculty of Engineering,

Mahasarakham University,

Kham Riang,

Kantarawichai,

Maha Sarakham

Phammatorn Intorn, Sony Technology (Thailand) Co., Ltd.

140 Bangkadi Industrial Alley,

Bang Kadi, Mueang Pathum Thani District,

Pathum Thani, 12000, Thailand

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Published
2019-06-30
Section
Research Papers