การปรับปรุงประสิทธิภาพของกระบวนการติดไดในการผลิตวงจรรวม

Abstract

Integrated circuit (IC) industry has been growing extremely and high competition. Then IC manufacturer must adapt them to enhance more production efficiency to gain product scheduling accordingly. For this study, the die bond process is the major problem. In this research improving more production efficiency is done by using scheduling technique and Single Minute Exchange of Die (SMED). The result reveals that production can reduce lots failed cycle time from 49.48% to 20.8% (reduced 58.54%) and also improved machine utilization from 70.92% to 78.44% (improved 10.6%).